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Dr.
Thermal HSF Review
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Author
: Joseph Leone : 31st October 2001
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3DVelocity would like to thank
Thermal
Integration Technology, Inc. and especially Jr. Chou, President,
for their help and courtesy in providing this cooler for review.
Introduction :
Thermal Integration sent
their Dr. Thermal TI-V77L. It's their good fortune (or misfortune)
to be the first unit tested under 3DVelocity's new Heatsink/Fan
test program. Under this new program, all the HSF units we obtain,
however we obtain them, will be tested using our "test
bench". If you'd like to see more about the test unit itself,
and the reasoning behind our decision to embark on this course,
you can read the entire article here.
The bottom line is to obtain results that can be compared across
the whole spectrum of available HSF units.
What you get :
Here's the package that
Dr. Thermal arrived in. It's strong..and certainly bright. Dr.
Thermal won't have any difficulty being seen on crowded shelves.

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First Impression:
Inside the box is Dr Thermal
himself...along with a few pieces of form fitting foam and a
tube of generic silicone thermal transfer compound. The packaging
will protect the good Dr from the usual bumps and grinds encountered
in shipping. One item of note is the fact that this unit is
fitted with a 70mm fan, not the usual 60mm we are all so used
to seeing. This may make upgrading to a higher CFM fan or an
80mm unit somewhat difficult. The fan itself is a 3 wire, rpm
sensing unit that runs quietly. It is a YS Fan ball bearing
unit that turns at 5000 RPM and delivers 38 CFM. T.I.T.I.'s
specs indicate an actual noise level of 41 dBA, and I'm going
to take their word for it. In the photo below, you can just
about see the actuating lever for the novel clip design, more
of which we'll show you later.

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Construction:
As you can see below, this
unit is composed of an aluminum superstructure with a copper
"slug" press fitted into it. Copper has a better rate
of heat transfer than aluminum does, so it's ideal for use as
a contact surface against the relatively small CPU die. The
copper slug has a much larger surface contact area with the
aluminum, so thermal transfer can take place at a fairly high
rate while still keeping weight down. The weight, by the way
is 288.5 grams...or about 10.2 ounces for you guys on this side
of the Atlantic...well below AMD and Intel published maximums.
My only caution here would be that the sharp fins could potentially
cause damage to the rubber spacers that AMD uses on their CPUs.
The overall finish is clean and neat, with no burrs or nicks
in any of the surfaces. The fins are spaced widely enough that
airflow should be fairly good, and the slightly curved shape
should provide good turbulence..and turbulence is what keeps
the air "scrubbing" the metal. That means less build-up
of hot "boundary layer" air to insulate and impede
heat transfer.

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Better Mousetrap:
Here we see the business
end of the clip system that really impressed me. The only way
this thing could be better would be the use of a jaw that grabbed
all 3 hooks on each side of the socket. We all know, of course,
that some of the HSF units out there are tough to mount..and
more than a few motherboards have been put out to pasture due
to broken socket hooks. If this clip design used all 3 hooks
to do the job, I'd give it a "10". Anyway, it just
couldn't be simpler. You just engage the clip on the hooks...it
fits just snugly..and then operate the locking handle just like
a ZIF socket handle. The clips tighten up nicely, there's no
chance of damaging anything with a slip-of-the-screwdriver,
and it's even easier to remove. This is the only HSF unit I
have ever used that I was able to mount and dismount with ONE
hand and no tools.


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Not Quite Perfect:
Here we see the reason for
the only really negative comment I have about general construction
and workmanship. This is a view of the Dr Thermal unit mounted
on a dummy Socket 462. As you can easily see, the "sweet
spot", the copper heatsink, is not quite where it should
be to correctly contact the CPU die, which, in a real application,
would be right in the middle of the square in the socket.
This abnormality might affect the overall performance of the
unit.

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Results and Opinions:
As I previously stated,
this is the first HSF review in what we hope will be a long
series of reviews. Because it's the first, we don't have a very
large database of results for you to compare. We do have something
for you, however, because this review is worthless unless there
is some baseline to compare with. I tested two other units with
Dr. Thermal. One was a generic cooler that actually came with
my retail packaged AMD CPU. It's a simple aluminum casting with
a 60 x 60 x 12 fan. The other is an OCZ Copper Gladiator that
I purchased about a year ago. It's been reviewed to death elsewhere,
so all I'm giving you now is raw test data. As we continue on
this program, we will be reviewing all newly released units,
and testing all of our previously reviewed units. Our database
will continually grow, and hopefully we can help you make the
right choice.
All the units are tested
the same way. 1500 grams of water at 80C are circulated through
our testing apparatus, with the time and temperature drop monitored.
We take the 10 minute period with the greatest temperature drop,
and simply calculate the calories and BTUs of heat transfer.
| Manufacturer |
Model |
Test Date |
10 min temp drop |
calories
|
BTUs |
| Thermal IntegrationTechnology,
Inc. |
TI-V77
|
10/31/01 |
11C
|
99,000
|
393
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| OCZ |
Copper Gladiator
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10/31/01 |
9.5C
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85,500
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339
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| Unknown |
AMD OEM
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10/31/01 |
9C
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81,000
|
321
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My Conclusion:
Dr Thermal is an excellent
performer when compared to OCZ's Gladiator and the little OEM
generic. The clip design is so simple that I'm amazed I haven't
seen it before now. It's a snap to operate. My only complaint
is the 70mm fan. The odd size will make upgrades difficult,
although performance seems to be adequate right now. I think
if the alignment problem is solved, performance should improve
even more.
